Broadcom | In-field testing using In-system deterministic ATPG patterns - Tessent In-System Test

Varun Sehgal, IC Design Engineer at BROADCOM, provides an expert insight into BROADCOMS use of Tessent In-System Test for their in-field testing. In-field or In-System Testing has been using BIST mechanisms for Power-On/Power-Off of the device (POST). AI applications need to run periodic testing of the device in-field for interruptions caused by Silent Data Corruption (SDC), without adding extra BIST hardware for the logic testing. To achieve this, the targeted portions of the device must be accessible for test, while the rest of the device is running in functional mode. Tessent In-System Test provides an APB-based architecture as an optimal method to test the device In-field by enabling you to deliver In-System Embedded Deterministic Test (IS-EDT) patterns via SSN for on-chip distribution of the patterns to the cores. The In-system Controller (ISTC) can perform this function of running IS-EDT and also uses the existing IJTAG network to perform the BIST functions. It also generates an embedded C program. BROADCOM used the Tessent solution with SSN-lite at chip-level to deliver packetized data to test the cores. DISCOVER TESSENT | Tessent helps customers address debug, test, yield, safety, security and optimization requirements for today’s most complex SoCs, by reducing design complexity using high-quality DFT. Tessent solutions include advanced debug, safety & security features and in-life data analytics. Tessent Silicon Lifecycle Solutions is a division of Siemens EDA and is widely recognized as an industry leader in delivering design augmentation and linked applications that detect, mitigate and eliminate risks throughout the IC lifecycle. LEARN MORE: https://eda.sw.siemens.com/en-US/ic/tessent/?partnerref=U2UNA25Broadcom-Infieldtesting FOLLOW TESSENT on LinkedIn: https://www.linkedin.com/showcase/tessent-solutions/ Email: [email protected]