Chip Modules Glue Tape Laminating Machine for Cards

Technical Parameters Dimension:L1930mmxW660mmxH1 760mm Net Weight:430Kg Power:AC220V .50/60Hz Rated Power:0. 8KW Air Pressure:6kg/cm2 Air Consumption:80LMin Control System:PLC+servomotor system Capacity:12000pcs/Hour Features + Automatically put chips and collect chips after tape gluing. + Alarm system will stop machine if module or glue tape run out. + Hot melt glue tape mold and chip stepping correct positioning device makes transportation and tape lamination more faster and accurate. + High-precision constant temperature heating device makes tape lamination stay stable. + Two types of different size punching die are installed to save time and avoid changing tool frequently. + Easy operation and maintenance.