🔬 Inverted Chip Packaging – Real-time shooting of the process of micro-diameter solder paste dotting with tiny solder paste dots
Real-time demonstration of solder paste dotting as small as 0.08mm, with consistency ±0.02mm and repeatability ±0.005mm.
✨ First constant-temperature solder paste technology – no clogging, no missed dots.
✨Dot diameter consistency: C PK ≥ 1.33
✨ Supports planar recess micro-dotting for advanced packaging needs.
✨ Compatible with 4/5/6/7th solder paste:
▪ 4#: from 0.20mm
▪ 5#: from 0.15mm
▪ 6#: from 0.08mm
Contact us to learn more!
🌐 www.dellson-group.com
📲 WeChat/WhatsApp: Tina +86-13538622227
#Dellson #ChipPackaging #Semiconductor #MicroDotting #HighPrecision
