For packaging, dispensing is used for depositing encapsulants on the die, interconnect and package/PCB. It is also used for underfilling a flip chip arrangement. It offers a precise, accurate and repeatable method of depositing an encapsulant in digitally defined areas of a substrate. As a dispenser can deposit the material in any pattern, it is ideally suited to glob-top encapsulations and conformal coatings.
Find out more at https://advpackaging.co.uk/dispensing
Contact us at https://advpackaging.co.uk/contact to discuss your applications or requirements. We have a dedicated packaging facility with a range of equipment to provide you comprehensive packaging services.
