Dellson

✅Solve Your BGA Rework Challenges with Dellson DS-360 Facing slow, error-prone manual BGA rework? Struggling with PCB damage, misalignment, or inconsistent soldering? 💡The DS-360 Series BGA Rework System delivers: PCBA Loading → Auto Positioning → BGA Removal → Desoldering → Flux/Solder Paste Dipping → Placement → Soldering 🔹One-button automatic operation 🔹Modular hot air heating with independent temperature control 🔹Accurate positioning & smart BGA separation detection 🔹Non-contact tin removal, adaptive to PCB deformation 🔹Supports all solder/flux paste thicknesses with precise airflow control 🔹Barcode traceability for analysis & quality control 🔹Secure operation with separate management authority High precision, high flexibility, full automation — built for modern PCBA production. Contact us today! 🌐 www.dellson-group.com 📲 WeChat / WhatsApp: Tina +86-13538622227 #Dellson #BGAReworkSystem #SMT #PCBAssembly #ElectronicsManufacturing #Automation #AOI #SPI #Semicon #EMS #SmartFactory #QualityControl #Engineering #Industry40 #Electronics #ElectronicsAssembly #PCBManufacturing #AutomotiveElectronics