Dellson

🔹📈 Dellson 3D SPI — True 3D + AI for Faster, Smarter Solder Paste Inspection Dellson 3D SPI delivers high-speed, full-coverage solder paste inspection with True 3D + AI, ensuring every defect is caught in a single scan. It precisely identifies 0201 mm pad printing defects, adapts to complex processes with its high-precision Z-axis module, and accelerates production CT time with an advanced Moiré-elimination algorithm. 🔥A self-developed motion control system, low-angle dual-projection, and RGB multi-color lighting provide clearer 3D details and more accurate defect recognition. Powerful SPC analysis and AI big-data training further enhance process control and inspection intelligence. Contact us for solutions or a demo anytime! 🌐 www.dellson-group.com 📲 WeChat/WhatsApp: Tina +86-13538622227 #Dellson #3DSPI #SPI #SMT #SolderPasteInspection #Automation #SmartManufacturing #ElectronicsManufacturing #PCBAssembly #PCBA #Industry40 #QualityControl