ficonTEC – Active passive align & attach operations for polyboard operations

Passive align-&-attach operations for polyboard applications at Fraunhofer HHI in Berlin using a CustomLine CL1500 adaptable die bonder. Sporting the largest range of optional modules available to any ficonTEC machine system, the CustomLine (previously known as CompactLine) is our most adaptable and versatile die bonder platform. These machines are designed to provide diverse ‘off-the-shelf’, pre-configurable solutions for customers in the semiconductor and photonics assembly and packaging sector. The stand-alone CustomLine CL1500 delivered to Fraunhofer HHI is equipped with 9 individual active/passive assembly functions – including mounting a gain element to a sub-mount, active alignment of the sub-mount to a waveguide, passive/active alignment to a photodiode as well as additional align-&-attach steps for further micro-optical components. The CL1500is used for R&D purposes bei HHI itself, as well as to fulfill the HHI’s collaborative research commitments.