Part 4 - Improving Electronics Reliability: Comprehensive Multiphysics

Goal: Addressing thermal demands with miniaturization of electronics Reduce cost of cooling hardware selection Mitigate the risks for system integration Solution: End to End validation across various domain using seamless and intuitive workflows Reduce order modeling (ROM) capability to enable system validation under customer duty cycle Variation analysis to understand key sensitivities Benefits: Understand product performance when subjected to multiple physical conditions Optimized product designs by evaluating Electro-thermo-Mechanical effects Multidomain – Multiscale system level evaluation