Shielded Component Removal with Ceramic Heatshield

Unlike heat shield gel, this ceramic heat shield will not leave any residue at the end of the application, and can even be re-used multiple times. Step by Step Procedure: 1. Remove both black battery holders on the side of the board. 2. Fix the board into the board holder of the ST 350 and begin preheating the board at 130 C for 3-4 minutes. 3. Take the Heatshield material and cut a 1.25” by .8” rectangle. 4. From this rectangle, cut .25” off creating a slim rectangle. 5. Place the smaller rectangle up against the side of the shield, while placing the bigger half over the shield itself. 6. Apply flux to all the solder joints you intend to reflow. 7. Secure the heatshield ceramic with one long strip of Kapton tape along the long side of the component. Make the strip long enough so that it will fall over the edge of the PCB. 8. Lower the Heater head with the appropriate sized nozzle and input the following profile: 760F for 80 seconds at a Blower Speed of 7. 9. Once the cycle ends lift the heater head from the board and give the component a few seconds before removing the heatshield by grabbing the exposed kapton tape and pulling it over and away from the reflowed component. 10. Once the heatshield is removed, use the handheld vacuum pick to lift the component off the PCB.