Solder Joint Reliability using ANSYS Mechanical

More details at https://www.singularityeng.com/singularity-engineering-blog/2018/12/20/electronics-reliability-its-getting-hot-in-there Thermal cycling is one of the most common failure mode in electronics. This is a demonstration of the Darveaux method for Solder Joint Reliability simulation using the Anand Viscoplastic Model. This technique helps engineers to predict time to failure during accelerated thermal test.