Using the Dam & Fill Method to Protect Electronic Components - Prostech Solution

Dam and fill is a selective process that enables potting of individual areas on the PCB without affecting the surrounding surfaces and components. This process, also known as "frame and fill", uses two potting compounds of varying viscosity. A dam or frame made of high viscosity material is first dispensed around the section of the board to be protected. The resulting cavity is then filled with a liquid casting resin until the particular structures are completely covered. This process has a lot of benefits, such as: - Anti-moisture, Anti-damage, Anti-dirt for electronic components - Absolutely protect important electronic components, increase product reliability - Thermal Conductive - Reduce material costs - Reduce production time Prostech supplies total solutions for Dam and Filling applications including materials and equipment. Please contact us for more information. Website: prostech-asia.com