Semiconductor

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Welcome to semiconductor .On the channel you can find the cutting edge of Semiconductor Smart Manufacturing&industry 4.0;Data Analysis;IIoT;Machine Learning;...

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STAR-CCM+高级后处理培训之二、包括Color Map、颜色映射及灯光效果等

STAR-CCM+高级后处理系列培训视频第一集：后处理高级培训介绍及基本操作

Description of the main new functions of STAR-CCM+2402 version

如何快速应对多变的市场需求并更新产品设计是一项常见的工程挑战？

Introduction to joint fluid-structure interaction simulation between STAR-CCM+ and Simcenter 3D

FloEFD电磁与传热耦合仿真

GPU accelerated computing original video content

Machine Learning challenges in Metrology in Semiconductor Device Industry #KLA

Intel CEO Pat Gelsinger on Intel's place in the semiconductor industry. #Manufacturing@MIT

Cross-Disciplinary Innovations Required for the Future of Computing #AMD

TSMC founder Morris Chang on the evolution of the semiconductor industry #Manufacturing@MIT

STAR-CCM+流道拓扑优化之二、模型操作#STAR-CCM+#CFD#拓扑优化

Streaming Equipment Data for Smart Manufacturing #cimetrix

STAR-CCM+流道拓扑优化之三、模型光顺与验证#STAR-CCM+#CFD#拓扑优化

STAR-CCM+流道拓扑优化之一、拓扑优化方法介绍#STAR-CCM+#CFD#拓扑优化

EUV Lithography – Hardware Deep-dive

林本坚 Burn Lin -EUV Lithography

How Arm Powers Chips By Apple, Amazon, Google And More

Agile Manufacturing and Transformation

From AGV to AMR, smart factory evolves again

Advanced Backend Automation Technology #PDFSolutions #Cimetrix

Morris Chang of #TSMC and Joe Tsai of Alibaba Group

#Local-First Software

#Intel advanced packaging with glass substrates

#Meteor Lake Overview In-depth with Intel Architects and Engineers. #Intel

#Manufacturing Intel’s Latest Tech and Serving Foundry Customers

# Intel Glass Substrates Explained in 60 Seconds

On leadership #Jensen Huang and Joel Hellermark

How #Amazon Is Making Custom Chips To Catch Up In Generative A.I. Race.

AI and Packaging - Enabling HPC with Heterogeneous Integration