Heterogeneous Integration Issues And Developments

There are a slew of new developments in advanced packaging, from new materials, chiplets, and interconnect schemes, to challenges involving how to physically put chips in a package, metallization, thermal cycling, and parasitics in the interconnect path. Dick Otte, CEO of Promex Industries, talks with Semiconductor Engineering about how this will change chip design and manufacturing, and how those changes are likely to unfold.