Challenges For Heterogeneous Integration

Heterogeneous integration opens the door to an almost unlimited number of features in a single package, but it also adds system-level challenges into a small space filled with a whole spectrum of possible interactions. Mike Kelly, vice president of chiplets/FCBGA integration at Amkor Technology, talks with Semiconductor Engineering about a variety of issues ranging from uneven aging, warpage, and different mechanical stresses, as well as some possible benefits.