Technical Parameters
Dimension: L 3290mm X W 1100mm X H 1900mm
Weight: 2150KG
Power: AC220V, 50/60Hz
Rated Power: 8KW
Air Pressure: 6KG/cm2
Air consumption: 200LMin
Control system: PLC+Servomotor system
Production speed: 10000pcs/Hour
Features
+ SICP-04 is used to do embedding process. For high module
embedding, this machine is a good choice.
+ Automatically identify qualified cards and unqualfied cards,
and collect them separately.
+ Cooling system on hot soldering station can use any hot melt
adhesive without making card deformed.
+ Non-iled card will be automatically identfed by cavity
sensor to avoid embedding.
+ Automatic divide good card from defective cards.
+ Automatic alarm when chips run out & automatic put in chips
and defective module will be collected into waste box.
+ Easy operation and maintenance.
