SolderPastePrinting

BGA Fully Automatic Solder Paste Printing and Ball Placement Machine： 1. One-button operation, fully automated 2. Superior imaging system automatically generates ball placement programs 3. Printing system supports automatic FLUX or solder paste printing 4. High-precision, high-flexibility ball placement system supports single-die placement or multi-die placement 5. Stencil cleaning system with flexible cleaning frequency settings 6. Vision system automatically inspects printing and ball placement quality 7. Automatic alarm information storage 8. Three-tier permission management 9. 4M traceability automatically saves personnel, machine, material, and method information, seamlessly integrating with MES systems Applicable BGA range: Minimum: 3*3mm; Maximum BGA: 120*120mm (expandable to 240*240mm with optional upgrade) Solder ball range: 0.2–1.27mm Placement accuracy: ±0.02mm #SolderPastePrinting #BallPlacement #SemiconductorPackaging #SPI #AOI #semicon #ems #smt #electronicsmanufacturing #electronics #industry40 #electronicsassembly #pcbassembly #inspection #smartfactory #pcbmanufacturing #engineering #qualitycontrol #automotiveindustry #automotiveelectronics #medicaldevicemanufacturing