Part 2 - Improving Electronics Reliability: Thermal Reliability

Goal: Improve thermal integrity Optimize cooling strategies Understand thermal impact on electrical and mechanical reliability Solution: Comprehensive electro-thermal and thermo-mechanical multi-physics Address thermal management at multiple scales 3D high-fidelity physics-based reduced order modeling (ROM) capabilities Benefits: Enhanced cooling strategies Improved product reliability and decreased product development time Connections to electrical, structural, reliability and ROM solutions