Goal:
Electronics reliability , fatigue and life
Standards compliance : IPXX , MIL-STD 810
Variability: Material, Manufacturing and assembling
Solution:
Detailed traces and vias modeling using reinforcement
Nonlinear materials modeling
Seamless Workflow: Designers and simulation engineers
Benefits:
Trace effects, solder fatigue and assembly stress effects
Performance evaluation under environmental conditions and duty cycle
Product durability: Shock and drop events
Failure due to Moisture ingression
Trade off: Cost v/s Reliability
